摘要:為了開發新的電動和混合動力驅動交通工具需要的功率半導體模塊,要有新的模塊集成和封裝解決方案。文章介紹了SKiM®功率模塊,是采用無基板壓接觸點的模塊,確保了出色的熱循環能力和低的熱阻。
敘詞:功率模塊 彈簧觸點 無基板 熱阻
Abstract:New solution for module integration and assembly has to be found to explore power semiconductor modules that are necessary for new electric vehicles and hybrid vehicles. This articles introduces SKiM power module, which uses modules that have contact points without base-plates, thus promising excellent thermal circulation ability and low thermal resistance.
Keyword:power module, spring contact, without base-plates, thermal resistance